发明名称 Process for the preparation of phenolic resin-containing dispersions and their use as adhesives
摘要 Aqueous dispersions of a phenolic resole and a thermoplastics polymeric material or a rubber, suitable for use as adhesives, are prepared by (a) dissolving a solid thermoplastics polymeric material, such as a polyvinyl acetal or a nylon polyamide, or rubber in a phenol, (b) adding a nonionic or anionic surface active agent and/or protective colloid, (c) adjusting the mixture to a pH above 7 by addition of a base, (d) adding aqueous formaldehyde solution, or a formaldehyde donor, to a molar ratio of phenol to formaldehyde within the range 1:1 to 1:3, (e) if necessary, adding water, and (f) heating the mixture to form a phenolic resole.
申请公布号 US4400229(A) 申请公布日期 1983.08.23
申请号 US19810326961 申请日期 1981.12.02
申请人 CIBA-GEIGY CORPORATION 发明人 DEMMER, CHRISTOPHER G.;FRANCOMBE, ROGER;GARNISH, EDWARD W.;MASSY, DEREK J. R.
分类号 C09J5/00;C08G8/38;C09J161/06;C09J161/14;(IPC1-7):C09J5/02 主分类号 C09J5/00
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