| 摘要 |
PURPOSE:To decrease alkali errors and to control electroless plating solns. automatically without labor for maintenance by diluting the electroless plating soln. to be measured with a large volume of a specified ratio of water then measuring the compsn. thereof as a homogeneous soln. CONSTITUTION:A general electroless copper plating soln. contg. copper salts such as copper sulfate, complexing agents such as EDTA, reducing agents such as HCHO, and pH control agents such as NaOH is controlled automatically in the following way in the stage of measuring the compsn. of said plating soln. and replenishing the comsumed components: Said plating soln. is diluted with the tap water by which specified quality of water is obtained and which is so added thereto that the concn. ratio before and after the dilution attains 1/2-1/20. Parameters of >=1 kinds among the concn. of copper ions, pH, the concn. of HCHO, the concn. of stabilizers, the concn. of complexing agents, etc. are measured with respect to the diluted liquid. Since specified measuring conditions for samples are assured by the above-mentioned method, the errors in the measurement are decreased and the life of the measuring electrode is extended. |
