| 摘要 |
PURPOSE:To realize connection between the Josephson junction element and another electrode without using a contact junction, and to improve the density of integration by coating an upper electrode with an intermetallic AuIn2 compound. CONSTITUTION:A lower electrode 1 consisting of an alloy of lead, indium and gold is oxidized and a tunnel barrier layer 3 is formed, the upper electrode 2 composed of lead or an alloy containing lead and the intermetallic AuIn2 compound 6 are laminated continuously, and the two layers are formed collectively through a soft-off method. The intermetallic AuIn2 compound 6 can be formed through the continuous evaporation of Au-In, the simultaneous evaporation of Au and In or the simultaneous sputtering of targets of Au and In or the like. The intermetallic AuIn2 compound 6 functions as the protective film by coating the upper electrode 2 because it has electrical conductivity and also has corrosion resistance while it is connected directly to another electrode 5 and can be connected electrically. The protective film consisting of the intermetallic AuIn2 compound 6 prevents intrusion of In from the electrode 5 to the upper electrode 2. |
