发明名称 EPOXY RESIN COMPOSITION
摘要 PURPOSE:To provide a resin compsn. which can improve hardness during heating without deteiorating adhesion and can give copper-clad laminates having excellent heat resistance and adhesion, consisting of a solid epoxy resin and a phenol novolak/epoxy resin. CONSTITUTION:An epoxy resin compsn. is obtd. by blending a solid epoxy resin (A) with a phenol novolak/epoxy resin (B) in a molar ratio of A:B=20-30: 80-70. When the compsn. is used for the production of copper-clad laminates, hardness during heating can be improved without deteriorating adhesion to copper foil.
申请公布号 JPS58141235(A) 申请公布日期 1983.08.22
申请号 JP19820023008 申请日期 1982.02.15
申请人 MATSUSHITA DENKO KK 发明人 NISHIKAWA YOSHIKAZU
分类号 B32B15/092;B32B15/08;C08G59/00;C08L63/00;H05K1/03 主分类号 B32B15/092
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