发明名称 BONDING METHOD
摘要 PURPOSE:To control the shape of a loop by bonding wirings, then rising a tool to the prescribed position, moving it in reverse direction to the formation of the loop, erecting the neck and then moving it in a direction that tensions the loop. CONSTITUTION:A tool 14 is moved down, a ball 17 at the lower end is bonded to a pellet 18, a device is moved in the suitable distance in the reverse direction to the formation of a loop L in case of rising the tool, a neck part N is erected, and the device is then moved in the direction of forming the loop. Then, the tool 14 is moved down, a clamp 9 is operated for a short time to form the loop, clamped by clamps 9, 10 as prescribed, and wirings 3 are bonded to a lead frame 19. Since the neck of the loop is erected in this manner, the height of the loop can be sufficiently raised, the formation and correction of an under loop can be eliminated, thereby improving the manufacturing yield.
申请公布号 JPS58139435(A) 申请公布日期 1983.08.18
申请号 JP19820022503 申请日期 1982.02.15
申请人 TOKYO SHIBAURA DENKI KK 发明人 YAMAGUCHI MASAYOSHI;TSURUTA TOSHIROU;SUZUKI NOBUSHI;NAGASHIMA SUMIO;CHIBA KOUICHI;ATSUMI KOUICHIROU;KASHIMA NORIYASU
分类号 H01L21/60 主分类号 H01L21/60
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