发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent a package from cracking or notching by altering the shape of part of a lead frame, and projecting an impact buffering part except an electrode terminal out of the package. CONSTITUTION:Leads 4 of part of a lead frame are aligned and disposed at the periphery of a ceramic base 2, and supported by a low melting point glass 6. The base 2 is covered with a ceramic cover 3, and secured with the glass 6, thereby forming a package 1. A pin 4 of the body 1 at the short side is deformed, and an impact buffer unit 5 which is projected out of the body 1 is disposed. According to this structure, crack or notch produced due to interference to other parts can be prevented, thereby improving the reliability and holding preferable external appearance.
申请公布号 JPS58139458(A) 申请公布日期 1983.08.18
申请号 JP19820021152 申请日期 1982.02.15
申请人 HITACHI SEISAKUSHO KK 发明人 HORIUCHI KAZUO;MOCHIZUKI MASAYOSHI
分类号 H01L23/04;H01L23/00;H01L23/02;H01L23/50 主分类号 H01L23/04
代理机构 代理人
主权项
地址