| 摘要 |
<p>This device for cooling electrical or electronic components which produce lost heat, such as resistors (3), thyristors, diodes, capacitors etc., has a housing (1) which is closed at the top and open at the bottom and which has a baseplate (2), preferably made of ceramic. The baseplate (2) serves as a support for the components (3) in the interior of the housing, preferably thick-film or thin-film power resistors. The interior of the housing is potted in an elastic insulating compound (6). The connecting elements (4) of the components (3) pass through the housing lid. The housing (1) is mounted on a heat sink (9) which comprises a platform (10) having the dimensions of the baseplate (2). During the fixing of the housing (1) with the aid of screws (12) and nuts (13), the platform (10) pushes the baseplate (2) into the interior of the housing and consequently compresses the elastic insulating compound (6). This produces a mechanical prestressing, i.e. a homogeneous surface pressure between the baseplate (2) and the heat sink (9), which surface pressure is intensified still further while the components are in operation as a consequence of the components (3) being heated, and this makes it possible to transmit high power loss densities in a uniform, potential-free manner. <IMAGE></p> |
