| 摘要 |
PURPOSE:To enable the circumference of a photoresist to be perfectly removed even when it is not exposed on a matching exposure part, by exposing the circumference of a wafer in advance in a prealignment station, and then, transferring a pattern. CONSTITUTION:A wafer W brought with a conveyer 4 is received on a chuck 6 in an alignment station 3, adjusted in position by pressing rolls 7, fixed with evacuation, and prealignment of the wafer W in the rotation direction is executed. Then UV rays are projected from a light projector 9 to expose only the circumference of the wafer W rotated by one revolution together with the chuck 6. This wafer W is brought to a matching exposure part 2 to carry out transfer of a pattern by a projector 2, thus preventing such a disadvantage that the photoresist is scraped off as dust from the circumference of the wafer W. |
