| 摘要 |
PURPOSE:To efficiently adhere solder only to necessary position by forming a plurality of solder jet nozzles at a prescribed interval. CONSTITUTION:The pitch of jet nozzles 2 on the upper surface of a solder tank 1 is matched to that of a resin sealing device 5 for a lead frame 3, and the shape and area of the nozzle are selected to bond the solder only to the external leads 8 of the device 5 in a range 7 capable of bonding a solder jet 6 but not to bond the solder to a frame 4. When the frame 3 is disposed on the nozzles 2 corresponding to the device 5 and the solder jet 6 is injected, the solder loss can be reduced without soldering to a wasteful part, and a trouble due to unnecessary soldering can be prevented. |
