| 摘要 |
PURPOSE:To simplify the post-treatment of an electronic circuit device by sealing with polyphenylene sulfide capable of molding at a low pressure. CONSTITUTION:Polyethylene sulfide can be molded even at approx. 280 deg.C and 50kg/cm<2>, has no abnormal electrical and mechanical characteristics even in the molding in thickness of 44X27X15mm.<3>, and can be sealed in a high cycle such as at 3sec of injection and 8sec of hardening which includes the inserting time. When an electronic part using a novolac epoxy substrate, ceramic or porcelain substrate is sealed with this resin, the parts can be manufactured in a mass production inexpensively without burr, thereby simplifying the post-treatment. |
