| 摘要 |
Compensation of thermal drift of temperature sensitive circuitry in an integrated circuit is achieved by heating the temperature sensitive circuitry by applying power to a heating element in the integrated circuit, testing the temperature sensitive circuitry, and trimming a thin film compensation resistor in the circuitry in accordance with the testing results. The heating element is an integrated resistor (16) adjacent to or surrounding the temperature sensitive circuitry (12). As the temperature of the temperature sensitive circuitry (12) is increased, testing apparatus is used to measure a temperature sensitive parameter of the temperature sensitive circuitry control signals, indicative of the amount of required trimming of the thin film compensation resistor (19, 20) to compensate the thermal drift of the temperature sensitive circuitry (12). The control signals are utilized to control the operations of a laser which precisely trims the thin film compensating resistor by the required amount. <IMAGE> |
