| 摘要 |
PURPOSE:To enable the thin type formation of a mount structure at low cost by a method wherein a small through-hole is provided at the top end of a finger lead, and an Au ball formed at the top end of an extremely fine metallic wire is thermal compression bonded on the IC electrode via small hole of the finger lead. CONSTITUTION:In the plane drawing and the sectional drawing of the main part of a circuit substrate, the numeral 1 repersents an insulation substrate constituted of resin of polyimide, etc., and 2 the finger lead constituted of Cu foil formed on the insulation substrate 1. The finger lead 2 projects to the inner side of the device hole b for bonding formed on the insulation substrate 1. The small hole a is provided at the top end of the finger lead 2 at the position corresponded to the position of the IC electrode. The small hole a is necessary for a bonding which is performed. Besides, Au plating, etc. is performed to the finger lead 2 to keep conductivity and corrosion resistance. |
