| 摘要 |
PURPOSE:To reduce the wiring capacity between the photoreceptor and the scanning circuit, to reduce the time required for assembling (connecting) the titled device, and to improve the yield, by directly connecting a glass substrate or a ceramic substrate equipped with metallic electrodes which are connected to the photoreceptor with a printed circuit board having the scanning circuit to be used for scanning the photoreceptor by means of a connector. CONSTITUTION:On a glass substrate or a ceramic substrate 3, a film of a photoconductive material, such as CdS, CdS/CdSe, amorphous Si, etc., is formed by the sputtering metod, vacuum deposition method, plasma CVD method, etc., and a photoreceptor 1 is formed by the photoetching method. Then films of NiCr and Au are successively formed by the vacuum evaporation method, and a common electrode 2a and individual electrodes 2b are formed by the photoetching method. Moreover, the connection between a connector 5 and a printed circuit board 4 for the scanning circuit is achieved in such a way that a connector terminal 6 installed at one end of the connector 5 is directly soldered on the pattern on the printed circuit board. |
