| 摘要 |
PURPOSE:To obtain the IC card having high reliability while increasing the stiffness of card base-material itself by changing all electrical elements containing an IC chip, which must be formed into the IC card, and a circuit pattern into a module system. CONSTITUTION:An oversheet with a magnetic recorder 13 is prepared previously to either of oversheets 12 laminated onto the surface and back of a center core 11 through thermal transfer or stripe application, and positioned to a desired pattern, and a magnetic-recorder hard polyvinyl chloride laminate is obtained by the conditions of laminating. The card is acquired by punching the laminate by a trimming die patterned with desired size. The card is obtained, a concave section, plane size thereof is the same as or slightly larger than the IC module 10 and thickness thereof is the same as or deeper than that of the IC module, is cut, and the mounting section of the IC module 10 is formed. The IC module 10 is fixed into the concave section by using two-pack curing type acryl resin adhesives 15 in the low surface and side surface of the concave section. Thereby, the IC card is prepared. |
