| 摘要 |
PURPOSE:To offer a multi-pin type package at low cost without using a high class punching or an etching by a method wherein, using a composite substrate of three layers or more wherein a conductive circuit is formed on a flat plate metal or a composite alloy tape having an electrically insulating ceramic coating layer on the surface, a semiconductor chip is mounted thereon and connected by leads to a wiring pattern, and the required part is molded. CONSTITUTION:One wherein the electrically insulating film of Al2O3, BNSiC, Si3N4, etc. is formed in the thickness of 0.5-5mum on the substrate serving as a base by an ion plating method, etc. is used. The conductive circuits 4 and 5 are formed on the metallic flat plate having an insulation film and flexibility, then the IC chip 1 is mounted on the conductive circuit pattern 4, next the lead circuits 5 are connected to the IC chip 1 via fine wire leads 7 by bonding, and finally the entire body is molded by a resin mold 6. After molding, the end part 2 is worked by bending, and accordingly a package for a semiconductor for mounting is formed. |
