发明名称 LIGHT PRESSURE MECHANISM AND POLISHING METHOD FOR BOTH-SIDE SIMULTANEOUS POLISHER
摘要 PURPOSE:To prevent a workpiece from cracking and perform accurate and efficient polishing, by delivering a prescribed polishing agent and rotating an upper and a lower surface plates when the upper surface plate is in contact with the workpiece and by gradually increasing the pressure of the polishing. CONSTITUTION:A compressed spring 15, which can be adjusted to be balanced to the weight of an upper surface plate 1, is provided inside and related to a fluctuating plate 16. The upper surface plate 1 is elastically hung by a support 19 and an air cylinder 18, which is used to adjust polishing pressure. A base B is fitted with an air cylinder 5, which is used to keep the upper surface plate 1 stopped after it is moved down into contact with a wafer 10. The support 19 is fitted with a sensor 17 for detecting the displacement of the fluctuating plate 16. A detecting plate 20 is secured on a cylinder rod 12 to find out the descent of the upper surface plate 1 to generate a detecting plate signal ON/OFF. When the signal is generated, the action of the air cylinder 5 is ceased to stop the rod 12 and a polishing agent is delivered to perform grinding.
申请公布号 JPS58137554(A) 申请公布日期 1983.08.16
申请号 JP19820019691 申请日期 1982.02.12
申请人 HITACHI SEISAKUSHO KK 发明人 NAKAMURA TAKAO;TANAKA KATSUHISA
分类号 B24B37/005 主分类号 B24B37/005
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