| 摘要 |
PURPOSE:To simply form a resin film with thin film thickness on the back surface of a heat sink using a normal metal mold by a method wherein resin powder is previously dispersed into the cavity of a metal mold before mounting a lead frame, or resin powder is previously deposited on the back surface of the heat sink of the lead frame before being put into the metal mold. CONSTITUTION:Resin powder of epoxy, etc. 11, 11... is dispersed by a fixed amount onto the bottom surface of each cavity 10, 10... of the lower metal mold 9. Next, the back surface of each heat sink of a lead frame 1, 1... is placed on the resin powder 11, 11... dispersed onto the bottom surface of each cavity 10, 10... of the lower metal mold 9, then the lead frame is mounted, and thereafter the lead frames are pinched by the lower metal mold 9 and the upper metal mold 3, thus the mold clamp is performed. Then, fused resin is cast into the cavities 10, 10... in a state that the upper and lower metal molds 8 and 9 are heated to the temperature close to the resin melting point by a built-in heater (not illustrated), and accordingly the resin mold formation is performed. |
