| 摘要 |
PURPOSE:To provide a thermosetting resin compsn. which has a low boiling point, is inexpensive and soluble in solvents, has excellent workability, and exhibits excellent heat resistance after curing, consisting of a polyimide and an amine adduct obtd. by reacting a diamine compd. with an epoxy compd. CONSTITUTION:A resin compsn. consists of an amine adduct (A) obtd. by reacting a diamine compd. of formulaI(wherein R<1> is a 2C or higher bivalent org. group) with an epoxy compd. having at least two epoxy groups, and a polyimide (B) of formula II (wherein R<2> is an n-valent org. group; X<1>, X<2> are each H, halogen, an org. group; n>2). Pref. the diamine compd. is used in an amount of 1.5 to 10 times the stoichiometric amount of the epoxy compd. Pref. the amine adduct (A) is reacted with the polyimide (B) in a molar ratio of 0.2:1-1.5:1 in the absence of a solvent or in a low-boiling solvent such as dioxane or methyl ethyl ketone with heating to obtain the resin compsn. |
