发明名称 |
DRAHTVERBINDUNGSVORRICHTUNG |
摘要 |
A wire bonding apparatus which can variously change the shape of a loop of a bonding wire and can restrict the loop shape in accordance with specifications of an article being wire bonded. In the wire bonding apparatus, a wire guide unit moving both vertically and transversely, independently of a bonding tool, is disposed in proximity of the bonding tool which moves relative to the article to be wire bonded and which connects the wire between a first bonding region and the second bonding region. A mechanism is provided which changes the shape of the loop of the bonding wire when the wire guide unit moves vertically and transversely. |
申请公布号 |
DE3244323(A1) |
申请公布日期 |
1983.08.11 |
申请号 |
DE19823244323 |
申请日期 |
1982.11.30 |
申请人 |
HITACHI,LTD. |
发明人 |
SHIRAI,YUJI;OTSUKA,KANJI;USAMI,TAMOTSU;YAMASAKI,YASUYUKI |
分类号 |
H01L21/60;H01L21/607 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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