发明名称 DRAHTVERBINDUNGSVORRICHTUNG
摘要 A wire bonding apparatus which can variously change the shape of a loop of a bonding wire and can restrict the loop shape in accordance with specifications of an article being wire bonded. In the wire bonding apparatus, a wire guide unit moving both vertically and transversely, independently of a bonding tool, is disposed in proximity of the bonding tool which moves relative to the article to be wire bonded and which connects the wire between a first bonding region and the second bonding region. A mechanism is provided which changes the shape of the loop of the bonding wire when the wire guide unit moves vertically and transversely.
申请公布号 DE3244323(A1) 申请公布日期 1983.08.11
申请号 DE19823244323 申请日期 1982.11.30
申请人 HITACHI,LTD. 发明人 SHIRAI,YUJI;OTSUKA,KANJI;USAMI,TAMOTSU;YAMASAKI,YASUYUKI
分类号 H01L21/60;H01L21/607 主分类号 H01L21/60
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