发明名称 PROCESS FOR FABRICATING A HIGH DENSITY ELECTRICALLY PROGRAMMABLE MEMORY ARRAY
摘要 A process for fabricating an MOS electrically programmable memory array which includes a plurality of floating gate memory devices is disclosed. The process employs two layers of polysilicon, each of which are used to define a plurality of spaced-apart parallel lines with the lines of the other layer. Doped bit line regions are formed in the substrate in alignment with the first lines prior to the fabrication of the second lines. The first lines are etched in alignment with the second lines to define floating gates. Overlying metal lines (bit lines) are formed over the doped regions and coupled to the doped regions through periodic contacts. Substantially fewer contacts are required than in prior art arrays, permitting the fabrication of a higher density array.
申请公布号 GB2060999(B) 申请公布日期 1983.08.10
申请号 GB19800029844 申请日期 1980.09.16
申请人 INTEL CORP 发明人
分类号 H01L27/112;H01L21/768;H01L21/8246;H01L21/8247;H01L23/522;H01L29/788;H01L29/792;(IPC1-7):01L21/92 主分类号 H01L27/112
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