| 摘要 |
PURPOSE:To prevent the injection of charges, and to obviate the shortening of the life of carriers by grinding and roughening the back of a semiconductor substrate, evaporating metals, the principal ingredient thereof is Au, and thermally treating the substrate. CONSTITUTION:The element of a CCD image sensor is formed to the Si substrate, the back of the substrate with approximately 450mum thickness is ground up to approximately 290mum thickness, and a metallic layer having three-layer structure of Ni-V-Au is evaporated onto the back. When the substrate is treated in N2 for approximately 10 or 20min at 350-450 deg.C, the shortening of the life of carriers by grinding processing is prevented effectively, and the injection of charges is also obviated. |
