| 摘要 |
PURPOSE:To prevent defective bonding by forming a wiring conductor layer to a base material with an uneven surface such as a glass epoxy material through an additive method. CONSTITUTION:A resist mask is formed onto the base material with the uneven surface such as the glass epoxy material and Cu plated wiring 5 is formed, and an Al or Ni plated film 6 is stacked. The surface of the antioxidation film 6 is also roughened because the surface of the conductor layer 5 is formed in an uneven shape, and a contact area is increased substantially on bonding with an LSI chip. Accordingly, bonding strength is increased, and reliability is improved. |
