| 摘要 |
PURPOSE:To improve the workability in cutting-in as well as to prevent the contamination of cut pellets by a method wherein a low melting point metal layer, which was softened by preheating at the temperature below the melting point, is coated on the back side of a wafer, each pellet is pushed up from the side of the metal layer and separated, and it is caught from the side of the pellet surface. CONSTITUTION:The low melting point metal 6, consisting of the alloy such as Bi, Sn, Pb and the like, is coated on the back side of the wafer 1 for which an element has been formed, and a structure 7 in the state wherein the wafer 1 is cut into pellets 5, 5 and so on by a dicer is prepared. A pellet cutting and pushing up stick 8 is stored and plced on a die 10 having a built-in heater block 9, and a desired pellet 5' and a pushing-up stick 8 are positioned and placed. The pellets other than the desired pelet 5' are pressed by a pressing punch 11, the lifting-up stick 8 with which the low melting point metal 6 is fully heated up and softened is lifted up and the pellet 5' is cut out into the cavity 12, located in the pressing punch 11, together with a low melting point metal piece 6. Subsequently, the pressing punch 11 is raised and placed in a stand-by state, a vacuum attracting collet 13 is immediately lowered, attract and clamp the pellet 5' located on the pushing-up stick 8 and moved upward, and then the lifting-up stick 8 is lowered to a point inside the die 10. |
