| 摘要 |
PURPOSE:To enable to obtain a high quality semiconductor device by a method wherein, after dusts deposited on the substrate after washing are removed by washing again, the coating onto the substrate is performed. CONSTITUTION:The substrate 1 previously cleaned and preserved is mounted on an adsorption end provided on a motor rotary shaft 21 and adsorbed via an adsorption pipe 31. Next, the substrate 1 is rotated in the direction of the arrow A in this state, simultaneously an ultrasonic oscillation mechanism 4 is operated, and, while simultaneously giving a rotation and oscillation to the substrate 1, dusts deposited on the substrate 1 are washed off by the water injection from a water injection pipe 5. Then, the ultrasonic oscillation is stopped, and the substrate 1 is sufficiently dried. While successively rotating the motor 2, a resist is sprayed in an inertia gas atmosphere resulting in the formation of a fixed film. Thus, a washing effect can be enhanced by the simultaneous employment of sonic oscillation and substrate washing caused by a water injection. |
