| 摘要 |
PURPOSE:To simplify the insertion of a semiconductor wafer or the like into a heat treating furnace having a jig operating part as well as the drawing out of the wafer therefrom and the operation inside the furnace, by mounting a lid part at an opening formed at one end of the furnace. CONSTITUTION:A furnace body 1 is provided at one end opening thereof with a lid part 2 for closing the opening. A handle 12 and a pressure relief pipe 13 are attached to the outside of the lid part 2. A jig operating rod 5 and a thermocouple 7 are attached to the inside of the lid part 2. Accordingly, by removing the lid part 2 from one end of the furnace, the operating rod 5 and the thermocouple 7 can be simultaneously drawn out from the inside of the furnace. On the other hand, by mounting the lid part 2 at the opening at one end of the furnace, the operating rod and the thermocouple can be simultaneously inserted into the inside of the furnace. In a heat treatment, with a semiconductor wafer 14 supported by a treating jig 6, the jig 6 is inserted into the inside of the furnace by means of the operating rod 5. At the same time when the operating rod 5 is inserted into the inner part of the furnace, the opening at one end of the furnace is closed. |
