| 摘要 |
PURPOSE:To realize a producing process which is free from the gas generated by a heat aging test, etc., by adhering a substrate via a thermosetting adhesive at a temperature which is lower than the thermal decomposition level of the adhesive and by which an unreacted material has sufficient volatilization. CONSTITUTION:An IDT electrode 2a and a repeller 2b are formed on the primary surface of a surface acoustic wave substrate 1, and this substrate 1 is put onto the upper surface of a package stem 4 via an epoxy adhesive 5 and then fixed to the stem 4 at 200 deg.C in the air. A change of the decomposition gas factor of the adhesive due to the lapse of the heating time for adhesion is shown by a figure. A large quantity of gas is volatilized in a short time when the cure temperature is set at 200 deg.C. Then the electrode 2a is connected to a terminal pin 3, and a shell cap 6 covers over the electrode 2a to replace the air with the gaseous nitrogen. Then the substrate 1 is sealed airtight to complete the production. With such a resonator, the resonance loss is very small even after a heating process of 100hr. |
