发明名称 COPPER ALLOY FOR LEAD MATERIAL OF SEMICONDUCTOR EQUIPMENT
摘要 PURPOSE:To obtain a good lead material by a method wherein the improvement of the strength and heat resistance is contrived by adding Fe, Sn, and Zn to a normal Cu base metal, and the improvement of the quality of the alloy ingot by adding P. CONSTITUTION:When adding 0.05-0.5% Fe and 0.05-0.5% Sn to Cu, the strength and heat resistance can be improved without remarkably decreasing the thermal conductivity proper to Cu. The addition of Zn thereto at 0.05-1.5% further increases the strength and heat resistance. The addition of P at 0.002- 0.05% improves the workability. When these metals are added in excess of the range of composition for contents, the thermal conductivity remarkably decreases. Particularly in case of excess amount of P content, the bending workability decreases, and, in case of less content amount, the ingot quality decreases resulting in poor bending workability.
申请公布号 JPS58130549(A) 申请公布日期 1983.08.04
申请号 JP19820012715 申请日期 1982.01.29
申请人 FURUKAWA DENKI KOGYO KK 发明人 YAMATO KOUZOU;SHINOZAKI SHIGEO;AKASAKA KIICHI;KUROYANAGI TAKU
分类号 C22C9/00;H01L23/48 主分类号 C22C9/00
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