| 摘要 |
<p>PURPOSE:To improve the accuracy of the center of the chip of a semiconductor device, by forming rod shaped projections for positioning on a lead frame, and forming positioning holes in a resin hardening metal stage. CONSTITUTION:A positioning rod-shaped projection 10 is formed at a bridging part 4 of a lead frame 3, on which a semiconductor chip 7 is mounted. The lead frame 3 is inserted in a package 1, which is filled with an epoxy resin 2. The end of the lead frame is fixed to a cut-in part 5. A positioning hole 9 is formed between the individual package 4 in a metal stage 8. When the resin is hardened, the rod shaped projection 10 is inserted and fixed, and the position of the semiconductor chip 7 is fixed at a preset position. Thus the accuracy of the position of the lead frame in the three directions of X, Y and Z can be readily enhanced.</p> |
