| 发明名称 |
A method for reactive bias sputtering. |
| 摘要 |
<p>Bias sputtering is enhanced by providing a magnetic field having lines of force (55) that extend closely parallel to the exposed surface of a substrate (s) placed on a bias electrode (26), so that a dense glow discharge is achieved close to the substrate when a bias voltage is applied to the electrode in the presence of a coating source (23) in an evacuated chamber (11).</p> |
| 申请公布号 |
EP0084971(A2) |
申请公布日期 |
1983.08.03 |
| 申请号 |
EP19830300334 |
申请日期 |
1983.01.24 |
| 申请人 |
MATERIALS RESEARCH CORPORATION |
发明人 |
CLASS, WALTER H.;HURWITT, STEVEN D.;HILL, MICHAEL L. |
| 分类号 |
C23C14/34;C23C14/06;C23C14/35;C23C14/50;H01J37/34;H01L21/203;H01L21/285;H01L21/31;(IPC1-7):23C15/00;01J37/34 |
主分类号 |
C23C14/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
