发明名称 MANUFACTURE OF ELECTRONIC COMPONENT PARTS
摘要 PURPOSE:To effect a highly reliable sealing, by a method wherein an electronic part having terminal pins is inseted into a thermoplastic resin case molded with a portion of a lid plate connected thereto, and the case supported by a retainer jig so as to project therefrom is pressed against a heated head. CONSTITUTION:A case 5 in the form of a cup with one end open, which has one side of a lid plate 5a connected to a portion of its brim and further has an inductor element 6 housed therein with its exteranal terminal 7 directed upward, is retained in a through hole 3 in a retainer jig 1 disposed on a support table 4. The case 5 is larger in thickness than the jig 1 and is retained with its undersurface slightly extending beyond the undersurface of the jig 1. Then, the lid 5a of the case 5 is closed to cover the bottom surface of the element 6. The depth of a groove 4a in the table 4 has a predetermined dimension. The case 5 is retained while projecting from the undersurface of the jig 1 by a predetermined dimension. The jig 1 retaining the element 6 is mounted on a positioning table 8 of a heating device. The table 8 presses a hot plate 9 of a heated head against the jig 1. Then, a rod 10 is pushed up to weld the lid 5a to the opening edge of the case 5.
申请公布号 JPS58128716(A) 申请公布日期 1983.08.01
申请号 JP19820012281 申请日期 1982.01.27
申请人 TOUKOU KK 发明人 ARAKAWA MASASHI;FUTAMURA YUKIO
分类号 H01F41/12;H01G4/224;H01G13/00 主分类号 H01F41/12
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