| 摘要 |
PURPOSE:To clean up the wafer surface leaving no residual stain by a method wherein water is sprayed over the wafer surface while the wafers are being transferred from a processing vessel to a washing vessel. CONSTITUTION:The black powder (smut) and Si once dried up is hardly removed by supersonic radiation having influence upon the performances of Si if there are any residual powders. In general, the inorganic powder after metallic buffing or glass grinding once dried up is hardly removed. If drying is prevented by means of spraying water etc. while any wafers are being transferred to washing vessel after immersion in alkali water solution, no smut, metallic powder and dust are sticked at all having favorable effect on the performances of Si by means of taking a simple measure. |
