发明名称 PLASTIC-FORMING MOLD FOR SEALED SEMICONDUCTOR IN RESIN
摘要 PURPOSE:To improve production efficiency and to expand the scope of application of molds by a method wherein upper and lower formers are engraved in a thin, flat pair of upper and lower boards independent of the main bodies and the flat boards can easily be extracted from between the main bodies. CONSTITUTION:An upper cavity-provided board 30 is a thin, flat board, provided with a form 1', runner grooves 4', pot and cull 5. A lower cavity-provided board 31 is also a thin, flat board, provided with a form 2', gate 3', runner grooves 4', positioning pin 19 for lead frame a. The boards 30, 31 are so set by the pin 19 that the frame a, form 1', form 2' are correctly positioned. A pad 33 is attached with a screw 15 to a base 9 and a resin introducing pot 5 is integrated therewith. A pad 34 is attached with the screw 15 to a base 24. The boards 30, 31 are put together to be inserted between the pads 33, 34, when contact is established between flat surfaces. Such contact facilitates insertion and extraction. After forming, the boards 30 and 31 are separated, and the formed item is taken out. This improves workability, production efficiency, and realizes a molding system capable of meeting a wide range of automation.
申请公布号 JPS58128745(A) 申请公布日期 1983.08.01
申请号 JP19820012248 申请日期 1982.01.28
申请人 NIPPON DENKI KK 发明人 SATOU WATARU
分类号 H01L21/56;B29B13/00;B29C33/00;B29C45/37 主分类号 H01L21/56
代理机构 代理人
主权项
地址