| 摘要 |
PURPOSE:To enable a constitution wherein electric connections to the outside are not performed for every part of picture element recording and thus obtain a picture element line recorder which has less number of wirings and is rich in flexibility, by providing light guides constituted of semiconductive material on a semiconductor wafer whereon integrated circuits are formed. CONSTITUTION:On the surface of the semiconductor wafer 10, the integrated circuits 20 are formed, and normally a protection film 30 is formed on the surface thereof. For the protection film 30, an oxide film of SiO2, etc. is used, and an insulator of resin, etc. can be also used. Next, aperture parts 40 are formed at desired parts of the protection film 30, and then a photoconductive material 50 is formed on the upper surface of the protection film 30 including the aperture part 40. For the photoconductive material 50, e.g. single axial crystal LiNbO3 can be used. Then, this photoconductive material 50 is left only at the aperture part 40 and etching-removed. A protection layer 31 is formed again on the surface, the same processes are repeated, thereby light guides 2 formed by multilayers of the photoconductive material 50 are formed. |
