发明名称 DETECTING METHOD FOR POSITION OF SEMICONDUCTOR CHIP
摘要 PURPOSE:To detect the position of the chip by low cost constitution by setting up a light-receiving means to the nose of a base, which contacts with an expanding sheet on which the chip adheres and corresponds to a pickup nozzle, in an automatic bonder. CONSTITUTION:Holes 6a-6d are each formed at symmetrical positions on x and y axes and holes 7a, 7b at positions symmetrical to the hole 6a on a (y') axis parallel with the (y) axis in the plane of the nose of the base 5. Beams entering the holes 6a-6d are detected by light-receiving elements 9c, 9d through optical fibers 8c, 8d, and an XY base is driven until incident light is interrupted by the chips 1 by control signals. Beams are detected by the holes 6c, 6d, the XY base is moved in parallel, beams are detected by the hole 7a, the base is turned in the counterclockwise direction, and the base is stopped at a position where 7a is light-shielded together with 7b. Said constitution has simpler structure, is of low cost, and can detect the position of the chip accurately as compared to a pattern recognizing device.
申请公布号 JPS58125845(A) 申请公布日期 1983.07.27
申请号 JP19820008475 申请日期 1982.01.22
申请人 MITSUMI DENKI KK 发明人 OOHATA KOUICHI;SUMIKAMA MASAHIKO;OKADA MORIKAZU
分类号 H01L21/68;(IPC1-7):01L21/68 主分类号 H01L21/68
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