发明名称 MANUFACTURE OF LIGHT-EMITTING ELEMENT ARRANGEMENT BODY
摘要 PURPOSE:To accurately arrange all light-emitting parts in a line by a method wherein, after a number of light-emitting element bodies have been fixed on a subscribed substrate in one dimension or two dimensions, a groove is formed between the light-emitting elements of the prescribed numbers. CONSTITUTION:An insulating substrate is formed by coating an SiO2 film 43 on an Si substrate 42, and an Al film 44 to be used as a cathode electrode is coated on the whole surface. Then an N-type Si substrate 41, having a number of p type layers 40 which were formed rectilinearly leaving prescribed intervals on the surface, are fixed on the Al film 44 using Ag paste. A groove 45, reaching the SiO2 film 43 from the surface of the substrate 41, is cut for the P type layer 40 of prescribed number, and the substrate 41 is separated into a number of pieces containing a P type layer 40 of the prescribed number. Subsequently, the P type layer 40 is connected to an anode electrode 46 in common using wire bonding through the intermediary of an anode electrode 48, and, on the other hand, the Al film 44 which is isolated by the groove 45 is used as a cathode 47. Through these procedures, the rectilinear arrangement of a number of semiconductor layers can be obtained accurately and easily.
申请公布号 JPS58125877(A) 申请公布日期 1983.07.27
申请号 JP19820008321 申请日期 1982.01.21
申请人 MATSUSHITA DENKI SANGYO KK 发明人 MATSUDA NOBUHIDE
分类号 G09F9/33;H01L27/15;H01L33/08;H01L33/34;H01L33/62 主分类号 G09F9/33
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