| 摘要 |
PURPOSE:To contrive to prevent surely electrostatic destruction of the electronic parts, and moreover to reduce cost of packing by a method wherein the implement having space enabled to accommodate inside the electronic component parts of the plural number is formed using a material added with a conductive material. CONSTITUTION:The complement 10 is formed of vinyl chloride added with carbon, for example. The main bodies 21 of the package are accommodated in space 11 in the implement 10, leads 22 are accommodated in space 12, and stability is held by a protrusion 13 from the bottom when the parts are accommodated. An opening part 14 is provided in the longitudinal direction at the ceiling of space 11. Packing 30 of rubber, etc., is inserted in space 11 to prevent falling off. For dual-in-line IC's, a complement 40 having corresponding spaces 41-43 is used. The complement thereof can be manufactured inexpensively as compared with a complement manufactured of plastics, electrostatic destruction can be prevented surely, and the inside IC's can be identified through the opening part. |
