发明名称 PLATING DEVICE FOR LEAD FRAME
摘要 PURPOSE:To contrive to perform plating of uniform thickness, and to enhance productivity by simple work by a method wherein the lead frames are carried in order, and a fixedly supported electricity means on the cathode side is made to slidingly come in contact with the lead frame. CONSTITUTION:The lead frame 1 is transferred with rubber rollers 12, 14, the metal roller 16 is made to rotatingly come in contact with the lead frame at the position F to connect the lead frame to the cathode, and the lead frame is turned on electricity to be plated. The lead frame arrives at the position G not existing the metal roller 16 after the prescribed hours to complete plating. In place of the metal roller, brushes can be used also. According to this construction, thickness of the plating film can be nearly unified, and moreover productivity can be enhanced sharply by a simple work.
申请公布号 JPS58125858(A) 申请公布日期 1983.07.27
申请号 JP19820009136 申请日期 1982.01.22
申请人 MITSUBISHI DENKI KK 发明人 TOKUNAGA TAKAO;NANGOU SHIGEYUKI;BANJIYOU TOSHINOBU
分类号 C25D7/00;C25D17/00;C25D17/06;H01L21/48;H01L23/50 主分类号 C25D7/00
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