发明名称 FIXING SUBSTRATE FOR LIGHT-EMITTING ELEMENT
摘要 PURPOSE:To enable to have a light-emitting element to be attracted to a substrate using proper amount of pressure, to prevent the lowering of characteristics and yield rate as well as to simplify the formation of a light-emitting array by a method wherein a through hole is provided at the position where the light-emitting element will be fixed, and a conductive film is formed around the hole. CONSTITUTION:When a plurality of light-emitting elements 5 are fixed on an insulating ceramic substrate 1 of alumina and the like, first, a conductive film 2 to be used as an electrode in common is coated. Then, a through hole 3 reaching the substrate 1 is provided on the film 2, the through hole is surrounded by a fixing part 4 consisting of solder or conductive bonding agent, the substrate 1 is placed on a vacuum-chuck jig, and each element 5 is fixed temporarily using vacuum attraction applied from the back side of the substrate 1. Subsequently, the back side of the element 5 is fixed permanently on the film 2 by applying heat. Through these procedures, the pressure can be applied to the substrate 1 moderately, and the fixing work of the light-emitting element can also be performed easily without inflicting damage to the element.
申请公布号 JPS58125878(A) 申请公布日期 1983.07.27
申请号 JP19820008345 申请日期 1982.01.21
申请人 MATSUSHITA DENKI SANGYO KK 发明人 MIZUTANI TAKESHI;MATSUKI MIWAO
分类号 H01L25/075;H01L33/08;H01L33/62 主分类号 H01L25/075
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