| 摘要 |
<p>Apparatus for improving polished wafer flatness such as slices of semiconductor materials through mounting of the wafers onto a deformable thin disc carrier which is mounted through a resilient device to a rotable pressure plate, the combined mounting being rotably engageable with a rotable turntable supported polishing surface, the turntable having an axis of rotation to edge bow away from the mounted wafers. The carrier is deformed to a concave shape opening toward the bowed table; thus permitting the mounted wafers to achieve through rotation polishing, uniformly improved flatness.</p> |
