发明名称 Barrier-free, low-resistant electrical contact on III-V semiconductor material
摘要 A contact structure on indium-containing III-V semiconductor material is comprised of a four layer sequence consisting of an indium layer in direct contact with the semiconductor material, a zinc layer in contact with the indium layer, a chromium-nickel or chromium or palladium or platinum layer in contact with the zinc layer and a gold layer for external contacting with a lead. An exemplary embodiment of such contact structure exhibits specific contact resistance ranging between about 10-4 and 10-5 ohm x cm2.
申请公布号 US4395727(A) 申请公布日期 1983.07.26
申请号 US19810244723 申请日期 1981.03.17
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 LAUTERBACH, CHRISTL
分类号 H01L21/28;H01L21/285;H01L23/482;H01L29/45;(IPC1-7):H01L23/48;H01L23/54;H01L29/40;H01L29/54 主分类号 H01L21/28
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