| 发明名称 |
PACKAGE FOR SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SAME |
| 摘要 |
A package for an integrated circuit is provided with interconnected leads within accessable recesses in the enclosure of the package. The interconnections of the leads is severed to isolate each leads from all other leads. |
| 申请公布号 |
JPS58123748(A) |
申请公布日期 |
1983.07.23 |
| 申请号 |
JP19820234988 |
申请日期 |
1982.12.27 |
| 申请人 |
TEXAS INSTRUMENTS INC |
发明人 |
ANSONII ERU ADAMUSU |
| 分类号 |
H01L23/50;H01L23/057;H01L23/495 |
主分类号 |
H01L23/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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