首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
SEMICONDUCTOR WAFER ETCHING DEVICE
摘要
申请公布号
JPS58123730(A)
申请公布日期
1983.07.23
申请号
JP19820005670
申请日期
1982.01.18
申请人
TOKYO SHIBAURA DENKI KK
发明人
YANAGIDA YASUSHI;IMAGAWA MAKOTO;YONEDA TOSHIO
分类号
H01L21/306
主分类号
H01L21/306
代理机构
代理人
主权项
地址
您可能感兴趣的专利
HEATING DEVICE TO WHICH MICROWAVES ARE APPLIED
GAME MACHINE
EXHAUST TREATMENT DEVICE CONNECTION STRUCTURE OF SERVICE CAR
EXPOSURE METHOD AND DEVICE, AND MANUFACTURING METHOD FOR DEVICE
ADAPTER
INSULATION STRUCTURE AND HOT WATER STORAGE UNIT
MEASUREMENT INSTRUMENT AND MEASUREMENT METHOD
METHOD FOR MANUFACTURING SILANE CROSS-LINKED ELECTRIC WIRE, AND SILANE CROSS-LINKED ELECTRIC WIRE
POWDER AND GRANULAR MATERIAL SPRINKLING DEVICE
WIRELESS COMMUNICATION SYSTEM, TERMINAL, AND WIRELESS COMMUNICATION METHOD
CARD READER UNIT
LOW ODOR, HARD SURFACE SPORICIDES AND CHEMICAL DECONTAMINANTS
OPERATION METHOD OF APNEA MONITOR
PHOTOELECTRIC CONVERSION ELEMENT AND SOLAR CELL, AND METHOD FOR MANUFACTURING THEM
AIR CONDITIONING EQUIPMENT
PNEUMATIC TIRE
MOLDING APPARATUS
MOLDING APPARATUS
IMAGE FORMING DEVICE
SURFACE TREATMENT COMPOSITION AND ARTICLE OBTAINED BY USING THE SAME
