| 摘要 |
PURPOSE:To completely shield an alpha-ray energy by thinly forming by a spinner coating method an alpha-ray shielding material on the surface of a semiconductor element and fixing an alpha-ray shielding sheet through a heat resistant adhesive. CONSTITUTION:An alpha-ray shielding material is thinly formed as an alpha-ray shielding film by a spinner coating method on the surface of a wafer in wafer state, and is etched in the desired shape to expose electrodes on the surface of a semiconductor element, and the alpha-ray shielding film 1 is formed to cover the range more than the activated surface region 7 of the element 2 in which at a software error occurs. After the alpha-ray shielding film-coated element 2 is mounted on a mount of the lead frame 3 with solder material 4 and an electrode of the element 2 is connected to a lead frame 3 via Au wirings 9, an alpha-ray shielding sheet 6 is fixed through a heat resistant adhesive 5 having an alpha- ray shielding effect. The entirety covered with sealing resin 8 in this state. |
