发明名称 SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To cope with the design which requires many input and output terminals, by arranging either of first or second element group regions at a part adjacent to a peripheral part or one end of a bonding pad, arranging the other to the opposite side of a scribe line, thereby increasing the number of cells in a chip and the number of the bonding pads. CONSTITUTION:The first element group region 4 is arranged at the part adjacent to one end of the bonding pad part 3 on the opposite side of the scribe line 2, and the second element group region 5 is arranged at the part adjacent to one side of the first element group region 4 on the opposite side of the scribe line 2. In this constitution, the first and second element group regions 4 and 5 are provided in parallel in the direction at a right angle with respect to the scribe line 2. Therefore, a cell width L is not simultaneously affected by the required areas for the first and second element group regions as before, and the width L can be reduced to the limit of the physical restriction of the interval between the bonding pads 3 and the like. More cells than those in the conventional chip can be arranged along the scribe line 2 in the unit chip.</p>
申请公布号 JPS58124263(A) 申请公布日期 1983.07.23
申请号 JP19820007146 申请日期 1982.01.20
申请人 TOKYO SHIBAURA DENKI KK 发明人 KAWAKAMI SUSUMU
分类号 H01L21/822;H01L21/60;H01L23/528;H01L27/04;H01L27/118 主分类号 H01L21/822
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