| 摘要 |
PURPOSE:To enhance the reliability of a resin-package type semiconductor device in which a vitrification occurs by covering at least a vitrification film on the surface of a semiconductor element with heat resistant resin layer made of polyimide resin or the like. CONSTITUTION:A tab 8 is fixed through a solder 6 on an insulating substrate which is fixed through solder on a heat sink. A package 13 made of resin is formed by resin molding on the upper side of the heat sink. The package 13 seals the substrate, the tab 8, a semiconductor element 9 and wirings 12 and the like. In this manner, a heat resistant resin layer 24 which operates as a buffer is interposed between a vitrification film 18 and the package 13. Accordingly, even if an external force such as stress is applied to the package 13, the force can be absorbed by the layer 24, and large force is not accordingly applied to the film 18 with the result that the film 18 is hardly damaged. |
