发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To perform an excellent bonding operation without having manual help by a method wherein the bonding period is controlled by detecting the starting time of the bonding using a detector which detects the deflection of a wire bonding arm. CONSTITUTION:When a vertical moving mechanism 5 functions by the help of a driving motor 6 and the tip of the capillary 2, which is attached to the bonding arm 1, comes in contact with a bonding pad 7, a microscopic deflection is generated on the arm 1. This microscopic deflection is detected by a detectors 4a and 4b. A trigger signal which indicate the start of bonding, is obtained by properly processing the output signal of the detectors 4a and 4b.
申请公布号 JPS58123734(A) 申请公布日期 1983.07.23
申请号 JP19820005712 申请日期 1982.01.18
申请人 FUJITSU KK 发明人 TAMAMUSHI KAZUO;NOITSUSHIKI SADAO
分类号 H01L21/60 主分类号 H01L21/60
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