发明名称 COPPER ALLOY FOR LEAD MATERIAL OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve the bending workability and conductivity by a method wherein the lead material is formed of an alloy containing specified quantity of Cr, Sn and Cu. CONSTITUTION:The alloy for lead material comprises 0.03-0.2wt% of Cr, 0.03- 0.2wt% of Sn and residual of Cu. The strength and heat resistance of the alloy may be improved by means of adding Cr and Sn to Cu without remarkably degrading the conductivity and bending workability proper to Cu. Moreover, with 0.2wt% of P added, the strength and heat resistance of said alloy may be further improved. However, the content of Cr and Su exceeding respective upper limit remarkably degrades the conductivity of alloy while the content of P exceeding the upper limit thereof degrades both conductivity and workability of the alloy.
申请公布号 JPS58123746(A) 申请公布日期 1983.07.23
申请号 JP19820005789 申请日期 1982.01.18
申请人 FURUKAWA DENKI KOGYO KK 发明人 YAMATO KOUZOU;AKASAKA KIICHI;SHINOZAKI SHIGEO;KUROYANAGI TAKU
分类号 C22C9/00;C22C9/02;H01L23/48 主分类号 C22C9/00
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