发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To obtain a product of high yield and quality with good adhesive of a pellet by employing a pellet bonding low melting point glass having a melting point lower than the softening point of a sealing low melting point glass. CONSTITUTION:A pellet bonding low melting point glass 7 is formed to have a softening point of the temperature lower than a sealing low melting point glass 6, different from a sealing low melting point glass 6. According to this constitution, even if ceramic base is heated when a pellet 3 is fixed to a ceramic base 2, it may be heated to the softening point of the glass 7, but the glass 6 higher than the glass 7 may not be softened. Accordingly, the flow of the glass 6 into a cavity at the time of fixing the pellet 3 can be prevented, and the pellet can be preferably fixed by improving the softening of the glass 7.
申请公布号 JPS58124248(A) 申请公布日期 1983.07.23
申请号 JP19820006016 申请日期 1982.01.20
申请人 HITACHI SEISAKUSHO KK 发明人 HORIUCHI KAZUO
分类号 H01L23/02;H01L21/58 主分类号 H01L23/02
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