| 摘要 |
PURPOSE:To prevent corrosion by overall Ni-plating the surface of a lead frame. CONSTITUTION:A lead frame consists of a frame 1, mount 2 for a semiconductor chip, external terminals 3, coupling section 5 and wire bonding sections 6. The entire surface of the lead frame substrate is subjected to Ni-plating for the prevention of corrosion. Next, the mount 2 and wire bonding sections 6 are plated with Au or Ag, and the external terminals 3 with Sn or solder. Corrosion is prevented because Ni-plating prevents the material forming the lead frame substrate from exposure. |
