| 摘要 |
PURPOSE:To dissolve resin in a short period without inflicting an adverse effect on the internal structure by a method wherein resin-molded parts are soaked into a chemical solution, supersonic vibrations are given to the chemical solution and the entire resin, and the chemical solution is heated up. CONSTITUTION:After a resin sealed type IC1 has been soaked into the setting agent which has liquefied by heating, the IC 1 is set and a fixing agent 7 is coated around it. A hole 8 is cut on the fixing agent which is adhered to the surface of the resin of the parts which will be dissolved. The IC 1 is fixed using a metal wire 10, inserted into the beaker 11 wherein the chemical solution 12 such as strong acid and the like is stored, the resin is soaked in the chemical solution such as strong acid and the like, heated up in that state of condition using a heater 13, supersonic vibrations are applied by a supersonic cleaning machine 15, and the resin 2 is dissolved until the IC chip 4 will be exposed. |
